University of Illinois Team Is Engineering the Fix for the AI Heat Crisis

Mechanical engineers at the University of Illinois have developed a new chip cooling method that could significantly reduce the energy data centers spend on thermal management. The approach uses a mathematical design algorithm and is published in Cell Reports Physical Science.

Mechanical engineers at the University of Illinois Urbana-Champaign have developed a new approach to cooling computer chips that could reduce the share of energy data centers spend on thermal management. The method, published in Cell Reports Physical Science, pairs a mathematical design algorithm…

This story was originally published by 3D Printing Industry.