University of Illinois Team Is Engineering the Fix for the AI Heat Crisis
3D Printing Industry
AI SUMMARY
Mechanical engineers at the University of Illinois have developed a new chip cooling method that could significantly reduce the energy data centers spend on thermal management. The approach uses a mathematical design algorithm and is published in Cell Reports Physical Science.
FROM THE ARTICLE
Mechanical engineers at the University of Illinois Urbana-Champaign have developed a new approach to cooling computer chips that could reduce the share of energy data centers spend on thermal management. The method, published in Cell Reports Physical Science, pairs a mathematical design algorithm…
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