Formnext Asia Shenzhen 2026 Spotlights AM’s Role in Cooling AI Hardware
3D Printing Industry
AI SUMMARY
Formnext Asia Shenzhen 2026 will take place August 26-28 at the Shenzhen World Exhibition & Convention Center, highlighting additive manufacturing's applications in producing liquid cooling components for AI hardware. The trade show demonstrates how 3D printing technology is becoming essential for managing thermal challenges in data center and computing equipment.
FROM THE ARTICLE
Formnext Asia Shenzhen, the additive manufacturing trade show organized by Guangzhou Guangya Messe Frankfurt Co Ltd, will return to the Shenzhen World Exhibition & Convention Center from August 26 to 28, 2026, with a focus on how 3D printing is being used to produce liquid cooling components…
This story was originally published by 3D Printing Industry.
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