3D Printed plug-and-play Packaging Enables low-loss Fiber Coupling for Photonic Chips

Researchers led by Erik Jung from Heidelberg University, a German research university with programs in photonics and nanotechnology, together with collaborators including Wolfram Pernice from University of Münster, a public research university known for work in nanophotonics and materials science,…

This story was originally published by 3D Printing Industry.